One-stop Automation Glue Dispensing · Screw Locking · Glue Potting · Soldering Solution Provider

Online High Speed High Precision CCD System Full Automatic SMT Glue Dispenser Machine

  • Full Automatic SMT Glue Dispenser Machine
  • high speed automatic glue dispensing machine
  • High Speed Auto Glue Dispenser Machine
  • Full Automatic SMT Glue Dispenser Machine
  • high speed automatic glue dispensing machine
  • High Speed Auto Glue Dispenser Machine
     The full automatic glue dispenser machine is engineered for high-volume, high-accuracy SMT production. Its advanced CCD vision system ensures automatic positioning and real-time alignment correction, delivering micron-level dispensing precision (±0.01mm) even on complex and densely populated PCBs. Designed for full online operation, it integrates seamlessly with SMT production lines, reducing labor dependency and ensuring consistent, repeatable quality—making it an ideal solution for manufacturers seeking higher efficiency, precision, and production reliability.
Features
1.High cost performance.
2.Strong platform compatibility, contact and non-contact dispensing, to meet the dispensing operations of different products and processes.
3.Minimum width of excessive glue can be controlled in 0.2mm(related to the configuration and glue).
4.Powerful visual positioning system, can meet Mark point positioning, edge positioning, 3D scanning positioning.
5.ID identification, automatic program calling, fool-proofing and data statistics function helps to realize smart manufacturing.
6. Support the import function of computer graphics, which can import PLT files, TCF files and G code files.
7. The static eliminator can eliminate static electricity within ±100V.
Scope of application:Sensors, relays, power adapters, electronic toys, horns, electronic components, household appliances, electric vehicle controllers, computer digital products, handicrafts, mobile phone boards, coil products, key products, battery boxes, speakers Ring dispensing and bonding; speaker packaging and dispensing, optical semiconductor, mobile phone battery, notebook battery packaging, PCB board bonding and sealing,SMT, COB, IC, PDA, LCD sealing, IC packaging, IC bonding, chassis bonding, Optical device processing, metal parts packaging and gluing, quantitative liquid filling, chip bonding, automotive mechanical parts coating, mechanical sealing, etc.

Models XHD-G550 / XHD-G1200
Working area X550*Y800*Z110mm / X1200*Y800*Z110mm
Maximum load XY: 30KG; Z: 8KG
Moving speed X/Y: 1000mm/s; Z: ≤500mm/s
Screen showing PC
Analytical accuracy ±0.01mm
Positioning mode CCD visual positioning system
Automatic width adjustment range of conveying line 100–450mm Automatic width adjustment
Transmission mode Anti static belt
Incoming induction Optical fiber / photoelectric
Overall structure Square steel / aluminum profile structure
Motor System Servo motor / linear motor
Transmission module Linear module / ball screw
Dispensing method High frequency piezoelectric valve / screw
Motion interpolation function Any route in 3D stereoscopic space is possible
Height measurement function Laser displacement device
Automatic weighing function Accuracy ± 0.01mg
Automatic cleaning function are provided
Edit mode PC
Operating temperature 10–40°C
Operating humidity 20–90% no condensation
External interface IO+USB
Power / energy consumption AC220V 50–60Hz 2500W
Overall dimension Approximately L1200*W1500*H1660mm / W1950*L1600*H1660 (size for reference only, subject to actual product)
Weight About 1000kg / 2000kg

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