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Working range
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380(X) * 380(Y) * 100(Z) mm
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Max payload
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7kg / 5kg
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Max travel speed
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500 mm/sec (XY) / 100 mm/sec (Z)
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Transfer method
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Stepper motor, belt, precision rail
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XYZ position accuracy
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±0.008 mm
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Resolution
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0.01 mm
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Memory storage
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999 program setup (each program store up to 65535 spots)
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Operating method
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LCD, Teach pendant
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Motor
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Precision stepper motor
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Movement patterns
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3 axis spot to spot, continuous line, arc
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I/O
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1 input, 4 output (support expansion)
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Power supply
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AC220V 50/60Hz 0.5 kW
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Working environment
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Temperature 0-40℃, Humidity 20-90%
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Machine dimension
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520 * 583 * 645 mm
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Weight
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75 kg
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The Desktop Automatic AB Glue Dispensing Machine features a precision dispensing valve that is leak-resistant with a retraction function, ensuring clean shut-off and minimal dripping to reduce adhesive waste, and it includes a wear-resistant Teflon seal.
This 3 Axis AB Glue Dispensing Machine is designed to handle a wide range of industrial adhesives and fluid materials with stable output and high precision.
By selecting the appropriate dispensing valve, pump, and control parameters, the system can adapt to different viscosities and material characteristics.
Compatible materials include but are not limited to:
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Silicone
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EMI conductive adhesive
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UV adhesive
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AB adhesive (two-component adhesive)
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Instant adhesive (cyanoacrylate)
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Epoxy resin adhesive
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Sealant
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Hot melt glue
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Grease
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Silver glue
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Red glue
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Solder paste
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Thermal grease
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Transparent paint
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Screw fixing agents (thread lockers)
The
3 Axis Glue Dispensing Machine is widely applied in precision dot dispensing, line dispensing, bonding, sealing, coating, and quantitative filling processes. It is suitable for
sensors, relays, power adapters, electronic components, electronic toys, sounders, speakers, household appliances, electric vehicle controllers, computer digital products, mobile phone boards, coils, buttons, battery boxes, and handicrafts. The system is also extensively used for
speaker packaging and dispensing, optical semiconductor processing, mobile phone and laptop battery packaging, PCB bonding, COB, IC bonding and packaging, PDA and LCD sealing, chassis bonding, optical device processing, hardware parts coating, chip bonding, mechanical seals, and automotive mechanical parts coating, making it an ideal solution for both
electronics manufacturing and industrial precision dispensing applications.
